1: Is this a multi-chip in 1 package device?
No. The CMOS Harmonic Oscillator (CHO) is built on a single die. The device comprises of a monolithic architecture. Our single die, all-CMOS implementation allows us to utilize the thinnest IC packages, and enables the CHO to be designed into Multi-Chip Packages (MCP) where the complete elimination of the quartz crystal from the PCB is desired. Logically, all else being equal, the single die approach offers cost savings over some of the recently proposed 2 die in 1 package alternatives to quartz crystals. top 2: Which communication interfaces can you support?
Currently, our CHO product can support the most prevalent high speed serial and parallel interfaces. Our performance meets the requirements of: USB 2.0 HS/FS/LS
S-ATA Gen2/1
Common Audio & Video CODECs
General Purpose Microcontrollers Our products can be used successfully in most consumer and storage applications. Some common examples are: USB Flash drives, USB peripherals, Hard Disk Drives, Digital TV/monitors, Printers and general purpose microcontroller-based designs. For more information please see here top 3: What is Spread Spectrum Clocking?
Spread Spectrum Clock Generation (SSCG) is a frequency generation method where the clock frequency is modulated in a pre-determined manner to reduce the total Electro Magnetic Interference (EMI) of an electronics system. EMI occurs when an electronic device generates unwanted harmonics in the frequency spectrum, and impacts the operation and performance of nearby devices. With its CHO technology, Mobius Microsystems offers a powerful tool to lower EMI. Our devices build upon the industry standard SSCG techniques, by far the most effective and most preferred method to control EMI. Unlike conventional SSCG implementations however, the Mobius SSCG CHO replaces both the quartz crystal and the PLL ICs with a monolithic CMOS die, and generates Spread Spectrum Clocks without the need for an external resonator. The elimination of the quartz crystal improves reliability, eliminates bulky packages from the system and lowers BOM count. The elimination of the PLL improves performance by reducing clock jitter, and lowering phase noise and power consumption. For more information please see here. top 4: Do you use triangular modulation for Spread Spectrum Clocks?
We use a triangular modulation for our Spread Spectrum Clocks. In this method, the clock frequency is modulated with a linear, triangular profile at a user-selectable magnitude. We devised a unique and very effective way to modulate our clocks resulting in very low EMI. For more information please see here. top 5: What is the total frequency accuracy of your product in ‘ppm’?
The MM8201 series of products are designed to meet the total frequency accuracy requirements of the USB 2.0 HS interface, which is +/-500ppm over all operating conditions.
The MM8101 series of products are designed to meet the total frequency accuracy requirements of the S-ATA (serial ATA) Gen 1 and Gen 2 interface, which is +/-350ppm over all operating conditions.
Please see here to review MM8201 and here to review MM8101. top 6: Can I program different frequencies on the device?
While the frequency as well as many other settings of our devices is entirely programmable with our built-in Non-Volatile Memory in the post-assembly phase of our manufacturing flow, we don’t currently offer end-user, or distributor control over the programming of our device due to confidentiality concerns. We will program any specific frequencies or configuration settings that are needed for your design and ship you the finished, tested product. Since we perform all our programming at the post-assembly phase, our cycle time is significantly shorter than quartz oscillators. If on-site programming is absolutely necessary for you, please contact us here for a partnership agreement. top
7: What is the phase noise specification of your device? In dBc/Hz?
The architecture that is chosen for the CHO architecture guarantees excellent phase noise. The far-from carrier phase noise of the MM8201 device at 1MHz offset is better than -140dBc/Hz, which is equivalent to best-in-class quartz crystals and better than integrated quartz and MEMS oscillators. Please see here for a detailed discussion of our architecture and its impact on phase noise and jitter. top 8: How thin is your package?
Mobius currently offers its products in both package and wafer/die form. The package option is an industry standard 5x3.2mm package. The height of this package is 0.9mm. The die form products can be requested at very thin
profiles. Please contact Mobius to obtain the typical background thicknesses for wafer/die shipments. top | 
